MADRID, SPAIN – July 13, 2026 – LeapWave Technologies, a pioneer in high-frequency dielectric interconnect solutions, announces its participation as an exhibitor at the upcoming European Microwave Week (EuMW) 2026, taking place from October 4th to 9th at the ExCeL Exhibition Centre in London.
Marking a significant milestone in the company’s commercial and technical roadmap, LeapWave will host a live demonstration of its groundbreaking ultra-broadband technology. The live setup will showcase how LeapWave enables seamless, ultra-broadband interconnectivity through a single, highly efficient interface, addressing critical bottlenecks in next-generation high-frequency communication systems and semiconductor packaging.
Recognizing the vital role of global collaboration in advancing deep-tech infrastructure, LeapWave will be joined at its booth by its strategic Japanese partners, ROHM Semiconductor and NTT Innovative Devices. The co-exhibitor status of these industry giants highlights a deep, ongoing technical partnership aimed at accelerating the commercial readiness of high-frequency wireless and packaging technologies.
«Exhibiting at EuMW 2026 alongside ROHM and NTT Innovative Devices is a testament to the strength of our international partnerships and the maturity of our technology,» said Dr. Alejandro Rivera-Lavado, CTO at LeapWave Technologies. «Our joint presence underscores a shared commitment to overcoming the physical limitations of conventional RF and electronics. The live demonstration will give the microwave and RF community a firsthand look at how our single-interface broadband technology can scale to meet the rigorous demands of future 6G and sub-THz infrastructure.»
Visitors to EuMW 2026 are invited to experience the live demonstration and meet with technical experts from LeapWave, ROHM, and NTT Innovative Devices at Booth # L334.
About LeapWave Technologies:
LeapWave Technologies is a deep-tech company specializing in the design and development of advanced high-frequency dielectric interconnect solutions. By bridging the gap between integrated photonics, RF electronics, and advanced semiconductor packaging, LeapWave enables high-capacity, low-latency data transmission required for future communication networks, including 6G and high-frequency wireless infrastructure. With its proprietary technology, LeapWave is building solutions for broadband instrumentation.
Contact: Muhsin Ali, RF Lead, LeapWave Technologies.
Email: muhsin.ali@leapwavetech.com