LeapWave Technologies

UNLIMITED BANDWIDTH.
UNLEASHED.

A paradigm shift in high-bandwidth interconnections — from DC to 500 GHz — in a single connector interface.

LEAPWAVE PORT — CONTINUOUS SPECTRUM < 0.15 dB/cm LOSS

DC 500+ GHz

[ One continuous, low-loss interface spanning millimeter-wave, sub-millimeter-wave and THz frequencies. ]

THE CONNECTIVITY WALL

[THE INDUSTRY CHALLENGE]

Traditional interconnects hit a wall well before the frequencies your systems need today.

Coaxial and rectangular waveguide standards were never built for the sub-millimeter and THz domain. Past a few hundred GHz, insertion loss climbs, integration gets brittle, and photonics and RF stop speaking the same language.

[THE LEAPWAVE SOLUTION]

Introducing Dielectric Rod Waveguide (DRW) Technology

Connecting the worlds of photonics and RF with a single interface — one continuous, low-loss path from DC to beyond 500 GHz.

001.

Ultra-Low Loss

Insertion and propagation losses kept under control across the full band.

< 1 dB/cm

002.

Ultra-Wide Band

Seamless, continuous operation across the entire spectrum in one interface.

0 -

0 + GHz

003.

Versatile Integration

Drop-in compatible with today’s standards via our low-loss coaxial transitions.

Coax & WG ready

004.

Hybrid Assembly

Bringing the best of RF and photonics together in one physical layer.

RF + Photonics

[Products]

One platform. Four ways to move beyond the mmWave limit.

( 01 )

DRW500

Ultra-low-loss signal propagation

50–500+ GHz

( 02 )

TX500

Ultra-wideband signal generation

50–500 GHz

( 03 )

RX500

Ultra-wideband amplitude reception

50–500 GHz

( 04 )

CT/110

Coaxial-to-DRW transition

1mm & 0.8mm coax

[WHERE IT'S USED]

Built for the systems pushing past the mmWave ceiling.

Instrumentation

Wafer Level Testing (WLT) for high-speed semiconductors.

Communications

Next-generation UWB interconnects for high-throughput links.

Non-Destructive Analysis

Contactless measurement across industrial and research settings.

Semiconductor Packaging

Hybrid assembly and integration for photonics + RF packaging lines.

[Solutions]

Scalable THz Integration
& Industry Solutions

01. IP Licensing (Core Commercial Model)

Integrate LeapWave Technology Into Your Platform

License our patented Dielectric Rod Waveguide (DRW) designs and photonic interfaces to build ultra-low-loss connectivity directly into your chips, packages, or equipment lines.

02. Custom R&D & Engineering

Design-in Support & Custom Integration

Partner with our multidisciplinary RF and photonics team to solve complex form-factor challenges, custom transitions, or specialized THz sensing setups.

[LATEST]

News & Funded Projects

LeapWave Technologies Achieves ISO 9001:2015 Quality Management System Certification

Demonstrating our rigorous commitment to quality, process control, and metrology-grade precision in high-frequency hardware development. LeapWave Technologies is proud to announce that it has successfully passed the initial audit for the ISO 9001:2015 Quality Management System certification, following an evaluation conducted by SGS International Certification Services Ibérica.

LeapWave Selected by EU Business Hub for Korea Electronics Show (KES 2026)

We are expanding into Asia and bringing our single-port ultra-broadband interconnect technology to the Korean market. Meet our team at the EU Pavilion in Seoul from October 12th–16th to discuss solutions for chip packaging and RF networks.

LUMINA Project Launches to Advance Ultra-High-Bandwidth Communication Technologies

LeapWave has joined a €4.8M Horizon Europe consortium coordinated by Thales Research & Technology. We are bringing our expertise in dielectric waveguide interconnects and high-frequency packaging to help develop low-power telecom networks operating up to 500 GHz.

LeapWave Technologies to Showcase Ultra-Broadband Interconnect Innovations Alongside Strategic Partners ROHM and NTT Innovative Devices at EuMW 2026

LeapWave Technologies, a pioneer in high-frequency dielectric interconnect solutions, announces its participation as an exhibitor at the upcoming European Microwave Week (EuMW) 2026, taking place from October 4th to 9th at the ExCeL Exhibition Centre in London.

Misiones IMPACT: Terahertz Sensing for Cancer Treatment Monitoring

Researching the integration of novel multiplexed photonic and hyperspectral THz architectures in a microfluidic in-vitro system.

Deep-tech engineering

for the next generation

of high-frequency systems.

LeapWave Technologies is a deep-tech company developing the physical interface between RF electronics and photonics.

DC–500+ GHz

One continuous interface