Overcome the I/O bottleneck in sub-millimeter and THz semiconductor packaging. Developing these interconnects from scratch is costly, time-consuming, and risky. LeapWave offers flexible intellectual property licensing and design-in engineering models so foundries and OEMs can adopt our patented Dielectric Rod Waveguide (DRW) technology without reinventing the wheel.
Featured IP Core: The LW C500 The LW C500 is a highly customizable microelectronic interface
Proven low-loss propagation (< 0.15 dB/cm) across the continuous 50–500 GHz spectrum.
Complete design packages and material specs tailored for mature semiconductor packaging lines.
Direct access to our engineering team to ensure high-yield integration with your proprietary ICs or packaging substrates.
The LW C500 is a highly customizable microelectronic interface powered by our DRW technology. Designed for semiconductor chip manufacturers and advanced packaging foundries, it provides a scalable physical layer for high-frequency RFICs and Photonic Integrated Circuits (PICs).
